Invention Grant
- Patent Title: Camera module
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Application No.: US17752262Application Date: 2022-05-24
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Publication No.: US11936969B2Publication Date: 2024-03-19
- Inventor: Se Yeon Hwang , Hyun Sang Kwak , Yeo Ok Jeon , Joon Woo Gi , Seok Hwan Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: MORGAN, LEWIS & BOCKIUS LLP
- Priority: KR 20210183629 2021.12.21
- Main IPC: H04N23/54
- IPC: H04N23/54 ; H04N23/57 ; H05K1/18

Abstract:
A camera module includes: a first substrate on which an image sensor configured to convert an optical signal incident through a lens module into an electrical signal is disposed and a first connection terminal is disposed; a second substrate spaced apart from the first substrate and including a second connection terminal formed in a position facing the first connection terminal; and a terminal connector electrically connecting the first connection terminal and the second connection terminal to each other and configured to maintain a preset distance between the first substrate and the second substrate. In the camera module, the terminal connector includes: a connecting member including a first connection portion, a second connection portion, and a deformable portion; and a support member configured to maintain the preset distance between the first substrate and the second substrate.
Public/Granted literature
- US20230199291A1 CAMERA MODULE Public/Granted day:2023-06-22
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