Invention Grant
- Patent Title: Output-integrated transistor amplifier device packages incorporating internal connections
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Application No.: US17313567Application Date: 2021-05-06
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Publication No.: US11936342B2Publication Date: 2024-03-19
- Inventor: Marvin Marbell , Jonathan Chang , Haedong Jang , Qianli Mu , Michael LeFevre , Jeremy Fisher , Basim Noori
- Applicant: Wolfspeed, Inc.
- Applicant Address: US NC Durham
- Assignee: MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
- Current Assignee: MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
- Current Assignee Address: US MA Lowell
- Agency: Myers Bigel, P.A.
- Main IPC: H03F1/02
- IPC: H03F1/02 ; H01L23/498 ; H01L23/66 ; H03F1/56
Abstract:
A semiconductor device package includes a plurality of input leads and an output lead, a plurality of transistor amplifier dies having inputs respectively coupled to the plurality of input leads, and a combination circuit configured to combine output signals received from the plurality of transistor amplifier dies and output a combined signal to the output lead.
Public/Granted literature
- US20220360230A1 OUTPUT-INTEGRATED TRANSISTOR AMPLIFIER DEVICE PACKAGES INCORPORATING INTERNAL CONNECTIONS Public/Granted day:2022-11-10
Information query
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