Invention Grant
- Patent Title: Transistor including a hydrogen-diffusion barrier and methods for forming the same
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Application No.: US17523967Application Date: 2021-11-11
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Publication No.: US11935935B2Publication Date: 2024-03-19
- Inventor: Min-Kun Dai , Wei-Gang Chiu , I-Cheng Chang , Cheng-Yi Wu , Han-Ting Tsai , Tsann Lin , Chung-Te Lin
- Applicant: Taiwan Semiconductor Manufacturing Company Limited
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee Address: TW Hsinchu
- Agency: The Marbury Law Group, PLLC
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L29/417 ; H01L29/66 ; H01L29/786

Abstract:
A thin film transistor includes a gate electrode embedded in an insulating layer that overlies a substrate, a gate dielectric overlying the gate electrode, an active layer comprising a compound semiconductor material and overlying the gate dielectric, and a source electrode and drain electrode contacting end portions of the active layer. The gate dielectric may have thicker portions over interfaces with the insulating layer to suppress hydrogen diffusion therethrough. Additionally or alternatively, a passivation capping dielectric including a dielectric metal oxide material may be interposed between the active layer and a dielectric layer overlying the active layer to suppress hydrogen diffusion therethrough.
Public/Granted literature
- US20220352333A1 TRANSISTOR INCLUDING A HYDROGEN-DIFFUSION BARRIER AND METHODS FOR FORMING THE SAME Public/Granted day:2022-11-03
Information query
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