Invention Grant
- Patent Title: Wrap-around-contact for 2D-channel gate-all-around field-effect-transistors
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Application No.: US17456947Application Date: 2021-11-30
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Publication No.: US11935930B2Publication Date: 2024-03-19
- Inventor: Julien Frougier , Ruilong Xie , Kangguo Cheng , Chanro Park , Andrew Gaul
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01L29/41
- IPC: H01L29/41 ; H01L29/40 ; H01L29/417 ; H01L29/423 ; H01L29/66 ; H01L29/78

Abstract:
Embodiments herein describe FETs with channels that form wrap-around contacts (a female portion of a female/male connection) with metal contacts (a male portion of the female/male connection) in order to connect the channels to the drain and source regions. In one embodiment, a first conductive contact is formed underneath a dummy channel. In addition an encapsulation material wraps around the first conductive contact. The dummy channel and the encapsulation material can then be removed and replaced by the material of the channel which, as a result, include a female portion that wraps around the first conductive contact.
Public/Granted literature
- US20230170394A1 WRAP-AROUND-CONTACT FOR 2D-CHANNEL GATE-ALL-AROUND FIELD-EFFECT-TRANSISTORS Public/Granted day:2023-06-01
Information query
IPC分类: