Invention Grant
- Patent Title: Plasma processing apparatus, plasma state detection method, and plasma state detection program
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Application No.: US16978134Application Date: 2019-06-17
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Publication No.: US11935731B2Publication Date: 2024-03-19
- Inventor: Daisuke Hayashi , Yoshihiro Umezawa , Shinsuke Oka
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer; Tanya E. Harkins
- Priority: JP 18124896 2018.06.29 JP 19032013 2019.02.25 JP 19099609 2019.05.28
- International Application: PCT/JP2019/023793 2019.06.17
- International Announcement: WO2020/004091A 2020.01.02
- Date entered country: 2020-09-03
- Main IPC: H01J37/32
- IPC: H01J37/32 ; G05D23/19 ; G08B21/18 ; H05B1/02

Abstract:
A measurement part controls power supplied to a heater such that a temperature of the heater becomes constant by using a heater controller, and measures the supplied power in an unignited state in which plasma is not ignited and a transient state in which the power supplied to the heater decreases after plasma is ignited. A parameter calculator performs fitting on a calculation model, which includes a heat input amount from the plasma as a parameter, for calculating the power supplied in the transient state by using the power supplied in the unignited state and the transient state and measured by the measurement part, and calculates the heat input amount. An output part configured to output information based on the heat input amount calculated by the parameter calculator.
Public/Granted literature
- US20210020418A1 PLASMA PROCESSING APPARATUS, PLASMA STATE DETECTION METHOD, AND PLASMA STATE DETECTION PROGRAM Public/Granted day:2021-01-21
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