Invention Grant
- Patent Title: Substrate support and plasma processing apparatus
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Application No.: US17190178Application Date: 2021-03-02
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Publication No.: US11935729B2Publication Date: 2024-03-19
- Inventor: Hajime Tamura , Yasuharu Sasaki , Shin Yamaguchi , Tsuguto Sugawara , Katsuyuki Koizumi
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JP 20054019 2020.03.25
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H02N13/00

Abstract:
The disclosed substrate support includes a first region, a second region, a first electrode, and a second electrode. The first region is configured to hold a substrate placed thereon. The second region is provided to surround the first region and configured to hold an edge ring placed thereon. The first electrode is provided in the first region to receive a first electrical bias. The second electrode is provided in at least the second region to receive a second electrical bias. The second electrode extends below the first electrode to face the first electrode within the first region.
Public/Granted literature
- US20210305025A1 SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS Public/Granted day:2021-09-30
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