An electronic assembly includes a chassis having electronic module mounting positions. The electronic assembly also includes a respective electronic module received in each electronic module mounting position and having a module cooling gas passageway. Each electronic module has a module glide surface. The electronic assembly includes a respective sealing retainer coupled between the chassis and each electronic module. The sealing retainer has a cooling gas passageway aligned with a chassis cooling gas passageway and the module cooling gas passageway. The sealing retainer includes a retainer body having a retainer glide surface, and a gas sealing gasket carried by the retainer body. The module glide surface and the retainer glide surface have respective cooperating features so that the respective electronic module is maintained in spaced relation from the sealing gasket as the respective electronic module is slidably inserted into a seated position.