Invention Grant
- Patent Title: Semiconductor light-emitting device and method of manufacturing semiconductor light-emitting device
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Application No.: US16979606Application Date: 2019-02-15
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Publication No.: US11929591B2Publication Date: 2024-03-12
- Inventor: Masahiro Murayama , Takashi Sugiyama
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: CHIP LAW GROUP
- Priority: JP 18050642 2018.03.19
- International Application: PCT/JP2019/005605 2019.02.15
- International Announcement: WO2019/181309A 2019.09.26
- Date entered country: 2020-09-10
- Main IPC: H01S5/22
- IPC: H01S5/22 ; H01S5/0234 ; H01S5/0237 ; H01S5/343

Abstract:
A semiconductor light-emitting device includes a stacked body, a cutout section, and a high-resistance region. The stacked body includes a first conductive-type semiconductor layer, an active layer, and a second conductive-type semiconductor layer in this order and has paired side faces opposed to each other. The cutout section is provided on at least one of the paired side faces of the stacked body and has a bottom face where the first conductive-type semiconductor layer is exposed. The high-resistance region is provided from the vicinity of the bottom face of the cutout section to the side face of the stacked body and has electric resistance higher than the electric resistance of the stacked body in a periphery of the high-resistance region.
Public/Granted literature
- US20210044088A1 SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING DEVICE Public/Granted day:2021-02-11
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