A method of manufacturing chip antenna and a structure of the chip antenna. The method includes the following steps: preparing a substrate, drilling a plurality of rows of external through holes and internal through holes arranged longitudinally, forming fishing grooves at the predetermined distance between every two of the internal through holes arranged longitudinally, electroplating a metal material on the external through holes and the internal through holes, to form a conductive layer. Afterward, a circuit layer is formed on the conductive layer by exposure, development, and etching techniques. An ink is printed on the substrate after the circuit layer finished, and the ink cover parts of the circuit layer and parts of the substrate exposed, to form a solder mask and a recognition pattern layer. Finally, a longitudinal cutting line and a horizontal cutting line are cut on the substrate, and to form a chip antenna.