Invention Grant
- Patent Title: Semiconductor device including trench structure and manufacturing method
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Application No.: US17583324Application Date: 2022-01-25
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Publication No.: US11929397B2Publication Date: 2024-03-12
- Inventor: Thomas Basler , Caspar Leendertz , Hans-Joachim Schulze
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE 2019105812.0 2019.03.07
- The original application number of the division: US16811293 2020.03.06
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L21/04 ; H01L29/06 ; H01L29/10 ; H01L29/16 ; H01L29/32 ; H01L29/66 ; H01L29/78

Abstract:
A semiconductor device includes: a silicon carbide semiconductor body having a source region of a first conductivity type and a body region of a second conductivity type; and a trench structure extending from a first surface into the silicon carbide semiconductor body along a vertical direction, the trench structure having a gate electrode and a gate dielectric. The trench structure is stripe-shaped and runs along a longitudinal direction that is perpendicular to the vertical direction. The source region includes a first source sub-region and a second source sub-region alternately arranged along the longitudinal direction. A doping concentration profile of the first source sub-region along the vertical direction differs from a doping concentration profile of the second source sub-region along the vertical direction. A corresponding method of manufacturing the semiconductor device is also described.
Public/Granted literature
- US20220149156A1 Semiconductor Device Including Trench Structure and Manufacturing Method Public/Granted day:2022-05-12
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