Invention Grant
- Patent Title: Multilevel semiconductor device and structure with image sensors and wafer bonding
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Application No.: US18382463Application Date: 2023-10-20
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Publication No.: US11929372B2Publication Date: 2024-03-12
- Inventor: Zvi Or-Bach , Deepak C. Sekar , Brian Cronquist
- Applicant: Monolithic 3D Inc.
- Applicant Address: US OR Klamath Falls
- Assignee: Monolithic 3D Inc.
- Current Assignee: Monolithic 3D Inc.
- Current Assignee Address: US OR Klamath Falls
- Agency: Patent PC
- Agent Bao Tran
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L23/00 ; H04N25/77 ; H04N25/78

Abstract:
An integrated device, the device including: a first level including a first mono-crystal layer, the first mono-crystal layer including a plurality of single crystal transistors; an overlying oxide disposed on top of the first level; a second level including a second mono-crystal layer, the second level overlaying the oxide, where the second mono-crystal layer includes a plurality of image sensors, where the second level is bonded to the first level with an oxide to oxide bond; a plurality of pixel control circuits; a plurality of memory circuits; and a third level disposed underneath the first level, where the third level includes a plurality of third transistors.
Public/Granted literature
- US20240047484A1 MULTILEVEL SEMICONDUCTOR DEVICE AND STRUCTURE WITH IMAGE SENSORS AND WAFER BONDING Public/Granted day:2024-02-08
Information query
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