Invention Grant
- Patent Title: Integrated fan-out package
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Application No.: US17740373Application Date: 2022-05-10
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Publication No.: US11929333B2Publication Date: 2024-03-12
- Inventor: Chuei-Tang Wang , Tzu-Chun Tang , Chieh-Yen Chen , Che-Wei Hsu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L27/14
- IPC: H01L27/14 ; H01L21/48 ; H01L21/56 ; H01L23/00 ; H01L23/31 ; H01L23/538 ; H01L23/66 ; H01L31/00 ; H01Q1/22 ; H01Q1/24 ; H01Q13/10
Abstract:
An integrated fan-out (InFO) package includes a die, an encapsulant, a redistribution structure, a slot antenna, an insulating layer, a plurality of conductive structures, and an antenna confinement structure. The encapsulant laterally encapsulates the die. The redistribution structure is disposed on the die and the encapsulant. The slot antenna is disposed above the redistribution structure. The insulating layer is sandwiched between the redistribution structure and the slot antenna. The conductive structures and the antenna confinement structure extend from the slot antenna to the redistribution structure.
Public/Granted literature
- US20220270990A1 INTEGRATED FAN-OUT PACKAGE Public/Granted day:2022-08-25
Information query
IPC分类:
