Invention Grant
- Patent Title: Wafer pre-aligner and method of pre-aligning wafer
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Application No.: US17005378Application Date: 2020-08-28
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Publication No.: US11929277B2Publication Date: 2024-03-12
- Inventor: John Charles Rogers , Margaret Kathleen Swiecicki
- Applicant: KABUSHIKI KAISHA YASKAWA DENKI , Yaskawa America, Inc.
- Applicant Address: JP IL Kitakyushu
- Assignee: KABUSHIKI KAISHA YASKAWA DENKI,YASKAWA AMERICA, INC.
- Current Assignee: KABUSHIKI KAISHA YASKAWA DENKI,YASKAWA AMERICA, INC.
- Current Assignee Address: JP Kitakyushu; US IL Waukegan
- Agency: MORI & WARD, LLP
- Main IPC: H01L21/68
- IPC: H01L21/68 ; G01N21/43 ; G01N21/95

Abstract:
A pre-aligner for pre-aligning a wafer having a notch. The pre-aligner includes a wafer platform having a wafer receiving surface, and a drive device. A detector is provided to detect the notch, and a memory is provided to store a notch window defining a range of angles in which the notch is predicted to be located in relation to a start position. A controller performs a pre-alignment operation where the wafer is rotated from the start position to an alignment location. The controller performs the operation such that the wafer is rotated at maximum acceleration/deceleration values from the start position to a notch location detected by the detector: where the operation is limited to a maximum velocity for rotation of the wafer from the start position to a notch window; and where the operation is limited to a scanning velocity within the notch window until the notch location is detected.
Public/Granted literature
- US20210074566A1 WAFER PRE-ALIGNER AND METHOD OF PRE-ALIGNING WAFER Public/Granted day:2021-03-11
Information query
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