Invention Grant
- Patent Title: Plasma generation device and plasma head cooling method
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Application No.: US17265743Application Date: 2018-08-28
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Publication No.: US11929237B2Publication Date: 2024-03-12
- Inventor: Shinji Takikawa , Tomoko Higashida , Takahiro Jindo
- Applicant: FUJI CORPORATION
- Applicant Address: JP Chiryu
- Assignee: FUJI CORPORATION
- Current Assignee: FUJI CORPORATION
- Current Assignee Address: JP Chiryu
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2018/031651 2018.08.28
- International Announcement: WO2020/044422A 2020.03.05
- Date entered country: 2021-02-03
- Main IPC: H01J37/32
- IPC: H01J37/32

Abstract:
A plasma generation device includes a plasma head configured to eject plasma gas that is plasmatized, a gas supply device configured to supply gas serving as the plasma gas to the plasma head, a pair of electrodes that is provided in the plasma head, the pair of electrodes being configured to perform discharging for a part of the gas supplied from the gas supply device to generate the plasma gas, a temperature sensor that is provided in the plasma head, the temperature sensor being configured to measure a temperature of the plasma head; and a control device, in which the control device executes a cooling process of cooling the plasma head by causing the gas supply device to continue supply of the gas until the temperature sensor measures a temperature equal to or less than a predetermined value after the discharging of the pair of electrodes is stopped.
Public/Granted literature
- US20210166919A1 PLASMA GENERATION DEVICE AND PLASMA HEAD COOLING METHOD Public/Granted day:2021-06-03
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