Invention Grant
- Patent Title: Circuit apparatus
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Application No.: US17438074Application Date: 2019-12-19
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Publication No.: US11894626B2Publication Date: 2024-02-06
- Inventor: Takamune Kikuta
- Applicant: AUTONETWORKS TECHNOLOGIES, LTD. , SUMITOMO WIRING SYSTEMS, LTD. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Mie
- Assignee: AUTONETWORKS TECHNOLOGIES, LTD.,SUMITOMO WIRING SYSTEMS, LTD.,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee: AUTONETWORKS TECHNOLOGIES, LTD.,SUMITOMO WIRING SYSTEMS, LTD.,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee Address: JP Mie; JP Mie; JP Osaka
- Agency: Venjuris, P.C.
- Priority: JP 19047232 2019.03.14
- International Application: PCT/JP2019/049862 2019.12.19
- International Announcement: WO2020/183850A 2020.09.17
- Date entered country: 2021-09-10
- Main IPC: H01R13/58
- IPC: H01R13/58 ; H01R12/58 ; H01R12/73 ; H01R13/24 ; H01R13/514 ; H01R13/516 ; H05K1/11

Abstract:
A circuit apparatus includes: a stacked body; and a plurality of terminals. The stacked body includes a plurality of layers. A plurality of holes that extend through the plurality of layers are formed in the stacked body. Each of the plurality of layers includes a connection member that is formed of a conductor. The connection member includes: a plurality of connection portions that are provided at positions corresponding to the plurality of holes; and a joining portion that connects the plurality of connection portions to each other. The plurality of terminals include a plurality of types of terminals that correspond to the plurality of layers. Each of the plurality of types of terminals can be selectively connected to the connection portion of a corresponding one of the plurality of layers by being inserted into a predetermined one of the plurality of holes.
Public/Granted literature
- US20220255249A1 CIRCUIT APPARATUS Public/Granted day:2022-08-11
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