Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17333743Application Date: 2021-05-28
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Publication No.: US11894451B2Publication Date: 2024-02-06
- Inventor: Aryan Afzalian
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- The original application number of the division: US16358394 2019.03.19
- Main IPC: H01L29/775
- IPC: H01L29/775 ; H01L29/10 ; H01L29/66

Abstract:
A semiconductor device includes first and second source/drain regions, a core channel region, a barrier layer, a shell, and a gate stack. The core channel region is between the first and second source/drain regions and is doped with first dopants. The barrier layer is between the core channel region and the second source/drain region and is doped with second dopants. The shell is over the core channel region and the barrier layer. The gate stack is over the shell.
Public/Granted literature
- US20210288168A1 SEMICONDUCTOR DEVICE Public/Granted day:2021-09-16
Information query
IPC分类: