- Patent Title: Launch structures for radio frequency integrated device packages
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Application No.: US16421221Application Date: 2019-05-23
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Publication No.: US11894322B2Publication Date: 2024-02-06
- Inventor: Bruce E. Wilcox
- Applicant: ANALOG DEVICES, INC.
- Applicant Address: US MA Norwood
- Assignee: Analog Devices, Inc.
- Current Assignee: Analog Devices, Inc.
- Current Assignee Address: US MA Norwood
- Agency: Knobbe, Martens Olson & Bear LLP
- Main IPC: H01L23/66
- IPC: H01L23/66 ; H01L23/498 ; H01L23/00
Abstract:
Radio frequency integrated device packages having bump and/or ball launch structures are disclosed herein. The bump launch structures can comprise patterned metallic and insulating material that substantially matches the impedance of a radio frequency integrated device die. The ball launch structures can comprise patterned metallic and insulating material that substantially matches the impedance of a system board.
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