Invention Grant
- Patent Title: Replacement material for backside gate cut feature
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Application No.: US17818601Application Date: 2022-08-09
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Publication No.: US11894260B2Publication Date: 2024-02-06
- Inventor: Wang-Chun Huang , Yu-Xuan Huang , Hou-Yu Chen , Kuan-Lun Cheng , Chih-Hao Wang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD
- Current Assignee Address: TW Hsinchu
- Agency: HAYNES AND BOONE, LLP
- The original application number of the division: US17186839 2021.02.26
- Main IPC: H01L21/762
- IPC: H01L21/762 ; H01L21/8234 ; H01L27/088 ; H01L29/06 ; B82Y10/00 ; H01L29/423 ; H01L29/66 ; H01L29/775 ; H01L21/764 ; H01L29/786

Abstract:
A semiconductor structure includes a gate structure surrounding a plurality of channels and a cut feature that electrically isolates two separate portions of the gate structure. The cut feature comprises an outer layer having a work-function metal, and an inner layer comprising a dielectric material. The cut feature extends above a top surface of the gate structure.
Public/Granted literature
- US20220384250A1 REPLACEMENT MATERIAL FOR BACKSIDE GATE CUT FEATURE Public/Granted day:2022-12-01
Information query
IPC分类: