Invention Grant
- Patent Title: MEMS microphone
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Application No.: US17827813Application Date: 2022-05-30
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Publication No.: US11863934B2Publication Date: 2024-01-02
- Inventor: Bei Tong , Rui Zhang
- Applicant: AAC Kaitai Technologies (Wuhan) CO., LTD
- Applicant Address: CN Hubei
- Assignee: AAC KAITAI TECHNOLOGIES (WUHAN) CO., LTD
- Current Assignee: AAC KAITAI TECHNOLOGIES (WUHAN) CO., LTD
- Current Assignee Address: CN Wuhan
- Agency: W&G Law Group
- Priority: CN 2123452788.4 2021.12.31
- Main IPC: H04R19/02
- IPC: H04R19/02 ; H04R7/04 ; H04R7/18 ; B81B3/00

Abstract:
The present invention provides a MEMS microphone, including a substrate and a capacitive structure. The capacitive structure includes a back plate and a vibration diaphragm. The vibration diaphragm includes a main body and a plurality of supporting structures for supporting the main body. Each supporting structure includes a supporting beam and two spring structures. Each spring structure includes at least two beam arms extending along the extension direction of the peripheral edge of the main body, and the beam arm closest to the main body is spaced apart from the main body. The sensitivity of the MEMS microphone in the present invention is higher.
Public/Granted literature
- US20230217191A1 MEMS Microphone Public/Granted day:2023-07-06
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