Invention Grant
- Patent Title: Headset kit
-
Application No.: US17477561Application Date: 2021-09-17
-
Publication No.: US11863926B2Publication Date: 2024-01-02
- Inventor: Changming Guo , Hongchao Zhou
- Applicant: Yibai Science & Technology (Shenzhen) Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Yibai Science & Technology (Shenzhen) Co., Ltd.
- Current Assignee: Yibai Science & Technology (Shenzhen) Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: Bayramoglu Law Offices LLC
- Priority: CN 1920440174.8 2019.04.02
- Main IPC: H04R1/10
- IPC: H04R1/10

Abstract:
A headset kit includes at least one Bluetooth earphone, a charging base used for charging each Bluetooth earphone, and an upper cover connected with the charging base. Supporting grooves used for supporting a first side of the each Bluetooth earphone are formed in the charging base, and through holes used for a second side of the each Bluetooth earphone to extend into are formed in the upper cover.
Public/Granted literature
- US20220007102A1 HEADSET KIT Public/Granted day:2022-01-06
Information query