Invention Grant
- Patent Title: Camera module
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Application No.: US17311079Application Date: 2019-12-19
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Publication No.: US11863850B2Publication Date: 2024-01-02
- Inventor: Da Hin Moon , Je Kyung Park
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR 20180165367 2018.12.19
- International Application: PCT/KR2019/018066 2019.12.19
- International Announcement: WO2020/130659A 2020.06.25
- Date entered country: 2021-06-04
- Main IPC: H04N23/51
- IPC: H04N23/51 ; H04N23/54

Abstract:
Provided is a camera module. The camera module according to one aspect of the present invention comprises: a housing; a substrate arranged on the housing; a substrate supporting member arranged on the housing and supporting the substrate; and a coupling member that fixes the substrate on the housing, wherein the substrate supporting member includes a body, an extending portion which extends from the body to be disposed between the substrate and the inside surface of the housing, a hole formed in the extending portion, and a bent portion which extends from the extending portion inwardly of the hole and towards the substrate.
Information query