Invention Grant
- Patent Title: Elastic wave device and method for manufacturing the same
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Application No.: US17968828Application Date: 2022-10-19
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Publication No.: US11863152B2Publication Date: 2024-01-02
- Inventor: Munehisa Watanabe , Hideki Iwamoto , Hajime Kando , Syunsuke Kido
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP 10288453 2010.12.24
- Main IPC: H03H9/02
- IPC: H03H9/02 ; H03H3/02 ; H03H3/04 ; H03H3/08 ; H10N30/01 ; H10N30/80 ; H10N30/85 ; H10N30/87 ; H03H9/54 ; H03H3/10

Abstract:
An elastic wave device includes a supporting substrate, a high-acoustic-velocity film stacked on the supporting substrate and in which an acoustic velocity of a bulk wave propagating therein is higher than an acoustic velocity of an elastic wave propagating in a piezoelectric film, a low-acoustic-velocity film stacked on the high-acoustic-velocity film and in which an acoustic velocity of a bulk wave propagating therein is lower than an acoustic velocity of a bulk wave propagating in the piezoelectric film, the piezoelectric film is stacked on the low-acoustic-velocity film, and an IDT electrode stacked on a surface of the piezoelectric film.
Public/Granted literature
- US20230037734A1 ELASTIC WAVE DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2023-02-09
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