Invention Grant
- Patent Title: Antenna structure and antenna-in-package
-
Application No.: US17717201Application Date: 2022-04-11
-
Publication No.: US11862874B2Publication Date: 2024-01-02
- Inventor: Wei Huang
- Applicant: AchernarTek Inc.
- Applicant Address: US CA San Diego
- Assignee: ACHERNARTEK INC.
- Current Assignee: ACHERNARTEK INC.
- Current Assignee Address: US CA San Diego
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01Q9/04
- IPC: H01Q9/04 ; H01Q1/02 ; H01Q5/378

Abstract:
An antenna structure includes a main radiator element, a parasitic radiator element, a feeder and at least one first high-impedance member. The parasitic radiator element is disposed in parallel with the main radiator element. The feeder is configured to electrically or electromagnetically couple the main radiator element. The at least one first high-impedance member directly contacts the parasitic radiator element and is configured to be electrically grounded.
Public/Granted literature
- US20230038429A1 ANTENNA STRUCTURE AND ANTENNA-IN-PACKAGE Public/Granted day:2023-02-09
Information query