- Patent Title: Method for forming semiconductor device structure with nanowires
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Application No.: US17460973Application Date: 2021-08-30
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Publication No.: US11862732B2Publication Date: 2024-01-02
- Inventor: Wilman Tsai , Cheng-Hsien Wu , I-Sheng Chen , Stefan Rusu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- The original application number of the division: US16574318 2019.09.18
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L27/092 ; H01L29/06 ; H01L29/423 ; H01L29/66 ; H01L21/02 ; H01L21/8238 ; H01L29/49 ; H01L27/088 ; H01L21/8234

Abstract:
Structures and formation methods of a semiconductor device structure are provided. The method includes providing a substrate having a first fin, and the first fin has a channel region and a source/drain region. The method includes forming a stack structure over the first fin, and the stack structure includes a first semiconductor layer and a second semiconductor layer vertically stacked over the fin. The method also includes removing a portion of the second semiconductor layer in the channel region, and a portion of the first semiconductor layer is remaining in the channel region. The method further includes forming a cladding layer over the remaining first semiconductor material layer in the channel region to form a nanostructure, wherein the nanostructure has a dumbbell shape. The method includes forming a gate structure surrounding the nanostructure.
Public/Granted literature
- US20210391480A1 METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE WITH NANOWIRES Public/Granted day:2021-12-16
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