Invention Grant
- Patent Title: High-K gate dielectric
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Application No.: US17827152Application Date: 2022-05-27
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Publication No.: US11862706B2Publication Date: 2024-01-02
- Inventor: Chia-Hao Pao , Chih-Hsuan Chen , Yu-Kuan Lin
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: HAYNES AND BOONE, LLP
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/423 ; H01L21/8234 ; H10B10/00 ; H01L29/51 ; H01L21/28 ; H01L21/02

Abstract:
Semiconductor devices and methods are provided. A semiconductor device according to the present disclosure includes a first transistor having a first gate dielectric layer, a second transistor having a second gate dielectric layer, and a third transistor having a third gate dielectric layer. The first gate dielectric layer includes a first concentration of a dipole layer material, the second gate dielectric layer includes a second concentration of the dipole layer material, and the third gate dielectric layer includes a third concentration of the dipole layer material. The dipole layer material includes lanthanum oxide, aluminum oxide, or yttrium oxide. The first concentration is greater than the second concentration and the second concentration is greater than the third concentration.
Public/Granted literature
- US20220293767A1 HIGH-K GATE DIELECTRIC Public/Granted day:2022-09-15
Information query
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