Invention Grant
- Patent Title: Contact structure for transistor devices
-
Application No.: US17738049Application Date: 2022-05-06
-
Publication No.: US11862692B2Publication Date: 2024-01-02
- Inventor: Oliver Blank
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L29/10 ; H01L29/423 ; H01L29/78

Abstract:
A transistor device includes field plate contacts that electrically connect a final metallization layer to field electrodes in underlying trenches, and mesa contacts that electrically connect the final metallization layer to semiconductor mesas confined by the trenches. Each field plate contact is divided into field plate contact segments that are separated from one another. Each mesa contact is divided into mesa contact segments that are separated from one another. In a first area adjacent to an end of the trenches, a first line that runs perpendicular to the trenches intersects a first field plate contact segment of the field plate contacts and a first mesa contact segment of the mesa contacts. In a second area spaced inward from the first area, a second line that runs perpendicular to the trenches intersects a second field plate contact segment of the field plate contacts and a second mesa contact segment of the mesa contacts.
Public/Granted literature
- US20220262910A1 CONTACT STRUCTURE FOR TRANSISTOR DEVICES Public/Granted day:2022-08-18
Information query
IPC分类: