Invention Grant
- Patent Title: Nitride semiconductor device and method for fabricating nitride semiconductor device
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Application No.: US17001617Application Date: 2020-08-24
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Publication No.: US11862687B2Publication Date: 2024-01-02
- Inventor: Ryo Tanaka , Shinya Takashima , Hideaki Matsuyama , Katsunori Ueno , Masaharu Edo
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kanagawa
- Priority: JP 19183283 2019.10.03
- Main IPC: H01L29/20
- IPC: H01L29/20 ; H01L21/20 ; H01L21/265 ; H01L29/78 ; H01L29/66 ; H01L29/06 ; H01L29/16

Abstract:
A nitride semiconductor device is provided, comprising: a first nitride semiconductor layer of a first conductivity-type; a second nitride semiconductor layer of a second conductivity-type provided above the first nitride semiconductor layer; a junction region of a first conductivity-type which is provided to extend in a direction from a front surface of the second nitride semiconductor layer to the first nitride semiconductor layer and has a doping concentration NJFET equal to or higher than that of the first nitride semiconductor layer; and a source region of a first conductivity-type which is provided more shallowly than the junction region and has a doping concentration equal to or higher than the doping concentration NJFET, wherein a dopant of the source region is an element with an atomic weight larger than that of a dopant in the junction region.
Public/Granted literature
- US20210104607A1 NITRIDE SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING NITRIDE SEMICONDUCTOR DEVICE Public/Granted day:2021-04-08
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