Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
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Application No.: US17319457Application Date: 2021-05-13
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Publication No.: US11862670B2Publication Date: 2024-01-02
- Inventor: Hsin-Fu Lin , Tsung-Hao Yeh , Chih-Wei Hung
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/78 ; H01L29/66

Abstract:
A semiconductor device includes a drift region, a dielectric film, and an anti-type doping layer. The drift region has a first type conductivity. The anti-type doping layer is located between the drift region and the dielectric film, and has a second type conductivity opposite to the first type conductivity so as to change a current path of a current in the drift region, to thereby prevent the current from being influenced by the dielectric film. A method for manufacturing a semiconductor device and a method for reducing an influence of a dielectric film are also disclosed.
Public/Granted literature
- US20220367611A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2022-11-17
Information query
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