To achieve a size reduction of a semiconductor package while securing stability in mounting. Three terminals t1, t2, and t4 are individually arranged on a semiconductor package 10 having a rectangular shape as viewed in plan in such a manner that the center in the longitudinal direction of the semiconductor package 10 of each of the three terminals t1, t2, and t4 and the center in the longitudinal direction of each of the other terminals are not overlapped with each other as viewed from the side of the long side. The terminal t4 and the other terminals t1 and t2 are arranged in such a manner that the terminal t4 and the other terminals t1 and t2 are present on mutually different sides across a line segment M passing through the center in the width direction, an angle θ formed by two line segments connecting the center of gravity of the terminal t4, the position in the longitudinal direction of which is the center, and the center of gravity of each of the other terminals t1 and t2 is 60° or more, and a width L1 of the semiconductor package 10 and a distance Lt between the rightmost end position of the terminal t4 arranged at the rightmost end in the width direction of the semiconductor package 10 and the leftmost end position of the terminal t1 or t2 arranged at the leftmost position in the width direction satisfy Lt/L1≥0.5.