Invention Grant
- Patent Title: Semiconductor device and method of fabricating the same
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Application No.: US17236362Application Date: 2021-04-21
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Publication No.: US11862632B2Publication Date: 2024-01-02
- Inventor: Kyong-Sik Yeom , Young Cheon Jeong
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO, LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO, LTD.
- Current Assignee Address: KR Suwon-si
- Agency: F. CHAU & ASSOCIATES, LLC
- Priority: KR 20200103022 2020.08.18
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/423 ; H01L29/49 ; H01L29/51 ; H01L29/78 ; H01L29/66 ; H01L21/8234 ; H01L21/28

Abstract:
A semiconductor device includes a first gate electrode structure having a first gate insulating layer on a substrate and a first gate electrode on the first gate insulating layer. A first spacer structure includes a first spacer and a second spacer on side walls of the first gate electrode structure. The first spacer is disposed between the second spacer and the first gate electrode. A source/drain region is disposed on opposite sides of the first gate electrode structure. The first gate electrode includes a lower part of the first gate electrode, an upper part of the first gate electrode disposed on the lower part of the first gate electrode, and the first spacer is disposed on the side wall of the upper pan of the first gate electrode and is not disposed on the side wall of the lower part of the first gate electrode.
Public/Granted literature
- US20220059529A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2022-02-24
Information query
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