Invention Grant
- Patent Title: Semiconductor device having a crack detection ring and a crack detection structure
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Application No.: US17392054Application Date: 2021-08-02
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Publication No.: US11862575B2Publication Date: 2024-01-02
- Inventor: Sung Ryong Lee
- Applicant: SK hynix Inc.
- Applicant Address: KR Gyeonggi-do
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T GROUP LLP
- Priority: KR 20210033175 2021.03.15
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/522 ; H01L23/58
Abstract:
A semiconductor device includes a crack detection ring and a crack detection structure. The semiconductor device comprises a first seal-ring surrounding a circuit region; a crack detection ring surrounding the first seal-ring; a second seal-ring surrounding the first seal-ring and the crack detection ring; a connection part connecting the first seal-ring and the crack detection ring; and a crack detection structure disposed in the circuit region and electrically connected to the crack detection ring.
Public/Granted literature
- US20220293532A1 SEMICONDUCTOR DEVICE HAVING A CRACK DETECTION RING AND A CRACK DETECTION STRUCTURE Public/Granted day:2022-09-15
Information query
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