- Patent Title: Dual side cooling power module and manufacturing method of the same
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Application No.: US17547949Application Date: 2021-12-10
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Publication No.: US11862542B2Publication Date: 2024-01-02
- Inventor: Hansin Cho
- Applicant: HYUNDAI MOBIS Co., Ltd.
- Applicant Address: KR Seoul
- Assignee: HYUNDAI MOBIS CO., LTD.
- Current Assignee: HYUNDAI MOBIS CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: MORGAN, LEWIS & BOCKIUS LLP
- Priority: KR 20180155073 2018.12.05
- The original application number of the division: US16697601 2019.11.27
- Main IPC: H01L23/49
- IPC: H01L23/49 ; H01L23/495 ; H01L23/498 ; H01L21/56 ; H01L21/60
Abstract:
A dual side cooling power module includes: a lower substrate including a recessed portion on at least one surface thereof, a semiconductor chip formed in the recessed portion, lead frames formed at both ends of the lower substrate, and an upper substrate formed on the semiconductor chip, a portion of the lead frames, and the lower substrate.
Public/Granted literature
- US20220102249A1 DUAL SIDE COOLING POWER MODULE AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2022-03-31
Information query
IPC分类:
