Invention Grant
- Patent Title: Soldering structure with groove portion and power module comprising the same
-
Application No.: US17374553Application Date: 2021-07-13
-
Publication No.: US11862537B2Publication Date: 2024-01-02
- Inventor: Jun Hee Park , Nam Sik Kong , Hyun Koo Lee
- Applicant: Hyundai Motor Company , Kia Corporation
- Applicant Address: KR Seoul
- Assignee: Hyundai Motor Company,Kia Corporation
- Current Assignee: Hyundai Motor Company,Kia Corporation
- Current Assignee Address: KR Seoul; KR Seoul
- Agency: MORGAN, LEWIS & BOCKIUS LLP
- Priority: KR 20200098153 2020.08.05
- Main IPC: H01L23/492
- IPC: H01L23/492 ; H01L23/00 ; H05K3/10 ; H05K3/34
Abstract:
A soldering structure configured for preventing solder overflow during soldering and a power module, may include a component to be soldered; and a metal layer having a bonding area, to which the component to be soldered is bonded by solder, and a groove portion formed around the bonding area.
Information query
IPC分类:
