Invention Grant
- Patent Title: Substrate processing system, vacuum substrate transfer module, and substrate transfer method
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Application No.: US17195163Application Date: 2021-03-08
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Publication No.: US11862506B2Publication Date: 2024-01-02
- Inventor: Norihiko Amikura , Masatomo Kita
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: XSENSUS LLP
- Priority: JP 20041800 2020.03.11
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/677 ; H01L21/67 ; H01L21/687

Abstract:
A substrate processing system includes a substrate processing module, an atmospheric substrate transfer module, a first and a second vacuum substrate transfer module, a load lock module, and a vacuum substrate transfer robot. The first vacuum substrate transfer module having a first transfer space is disposed adjacent to the atmospheric substrate transfer module and the substrate processing module. The second vacuum substrate transfer module, having a second transfer space in communication with the first transfer space and external dimensions smaller than those of the first vacuum substrate transfer module in a plan view, is disposed on or under the first vacuum substrate transfer module. The load lock module is disposed between the atmospheric substrate transfer module and the second vacuum substrate transfer module. The vacuum substrate transfer robot is disposed in the first transfer space or the second transfer space to transfer a substrate.
Public/Granted literature
- US20210287927A1 SUBSTRATE PROCESSING SYSTEM, VACUUM SUBSTRATE TRANSFER MODULE, AND SUBSTRATE TRANSFER METHOD Public/Granted day:2021-09-16
Information query
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