Invention Grant
- Patent Title: Substrate processing apparatus with electronic heater powered by power feeding coil
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Application No.: US17063828Application Date: 2020-10-06
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Publication No.: US11862489B2Publication Date: 2024-01-02
- Inventor: Satoshi Morita , Kouzou Kawahara
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer; Tanya E. Harkins
- Priority: JP 19190275 2019.10.17
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/687 ; H05B6/10
Abstract:
A substrate processing apparatus includes: a rotary stage configured to hold a substrate; a rotary driver configured to rotate the rotary stage around a rotation axis; at least one electric heater installed in the rotary stage; at least one power receiving coil installed in the rotary stage and electrically connected to the electric heater; at least one power feeding coil installed to face the power receiving coil in a direction of the rotation axis with a gap between the power feeding coil and the power receiving coil; and a radio-frequency power supply unit configured to supply radio-frequency power to the power feeding coil.
Public/Granted literature
- US20210118706A1 SUBSTRATE PROCESSING APPARATUS Public/Granted day:2021-04-22
Information query
IPC分类:
