Invention Grant
- Patent Title: Substrate processing method and substrate processing apparatus
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Application No.: US17467645Application Date: 2021-09-07
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Publication No.: US11862483B2Publication Date: 2024-01-02
- Inventor: Hiroshi Marumoto
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JP 20151297 2020.09.09
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/673 ; H01L21/687 ; H01L21/306 ; H01L21/02 ; H01L21/66
Abstract:
A substrate processing method includes performing a liquid processing, detecting a temperature, generating temperature distribution information and determining whether a result of the liquid processing is good or bad. The liquid processing is performed on a substrate by using a processing unit. A temperature of a central portion of the substrate and a temperature of an edge portion of the substrate in the liquid processing are detected by using multiple sensors provided in the processing unit. The temperature distribution information indicating an in-surface temperature distribution of the substrate in the liquid processing is generated based on one or more parameter values defining a processing condition for the liquid processing and the temperature of the central portion of the substrate and the temperature of the edge portion of the substrate. Whether the result of the liquid processing is good or bad is determined based on the temperature distribution information.
Public/Granted literature
- US20220076968A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2022-03-10
Information query
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