Invention Grant
- Patent Title: Electronic component and electronic device
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Application No.: US17823244Application Date: 2022-08-30
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Publication No.: US11862400B2Publication Date: 2024-01-02
- Inventor: Takahiro Shimizu
- Applicant: KABUSHIKI KAISHA TOSHIBA
- Applicant Address: JP Tokyo
- Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP 21152240 2021.09.17 JP 22085162 2022.05.25
- Main IPC: H01G4/228
- IPC: H01G4/228 ; H01G2/06

Abstract:
According to one embodiment, an electronic component includes an element, a first lead, and a second lead. The element includes a first electrode and a second electrode. The first lead is electrically connected with the first electrode, and has a flattened cross section. The second lead is electrically connected with the second electrode. The first lead includes a first connection portion, a first bonding portion, and a first extension portion. The first connection portion is connected with the first electrode. The first bonding portion is configured to be bonded with a substrate. The first bonding portion extends in an extension direction perpendicular to a first counter direction. The first counter direction connects the first electrode and the second electrode. The first extension portion is located between the first connection portion and the first bonding portion. The first extension portion extends in the extension direction.
Public/Granted literature
- US20230085659A1 ELECTRONIC COMPONENT AND ELECTRONIC DEVICE Public/Granted day:2023-03-23
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