Invention Grant
- Patent Title: MRAM stacks and memory devices
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Application No.: US17876587Application Date: 2022-07-29
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Publication No.: US11862373B2Publication Date: 2024-01-02
- Inventor: Shy-Jay Lin , Wilman Tsai , Ming-Yuan Song
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01F10/32
- IPC: H01F10/32 ; G11C11/16 ; H01F41/32 ; H10B61/00 ; H10N50/01 ; H10N50/80 ; H10N50/85

Abstract:
Memory stacks, memory devices and method of forming the same are provided. A memory stack includes a spin-orbit torque layer, a magnetic bias layer and a free layer. The magnetic bias layer is in physical contact with the spin-orbit torque layer and has a first magnetic anisotropy. The free layer is disposed adjacent to the spin-orbit torque layer and has a second magnetic anisotropy perpendicular to the first magnetic anisotropy.
Public/Granted literature
- US20220367098A1 MARM STACKS, MRAM DEVICES AND METHODS OF FORMING THE SAME Public/Granted day:2022-11-17
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