Invention Grant
- Patent Title: Substrate processing system, substrate processing method and computer-readable recording medium
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Application No.: US16624951Application Date: 2018-06-07
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Publication No.: US11858092B2Publication Date: 2024-01-02
- Inventor: Munehisa Kodama , Takahiro Sakamoto
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Shih IP Law Group, PLLC.
- Priority: JP 17121183 2017.06.21
- International Application: PCT/JP2018/021873 2018.06.07
- International Announcement: WO2018/235619A 2018.12.27
- Date entered country: 2019-12-20
- Main IPC: B24B7/22
- IPC: B24B7/22 ; H01L21/304 ; H01L21/683 ; H01L21/66 ; B24B7/04 ; B24B49/02 ; B24B49/12
Abstract:
A substrate processing method of thinning a substrate having a protective tape attached on a front surface thereof includes measuring a thickness of the protective tape; and grinding, by using a grinder, a rear surface of the substrate held by a substrate holder.
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