Invention Grant
- Patent Title: Medical apparatus remanufacturing method
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Application No.: US17078162Application Date: 2020-10-23
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Publication No.: US11858074B2Publication Date: 2024-01-02
- Inventor: Tatsuya Suzuki , Hideo Sanai
- Applicant: OLYMPUS CORPORATION
- Applicant Address: JP Hachioji
- Assignee: OLYMPUS CORPORATION
- Current Assignee: OLYMPUS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Main IPC: A61B17/00
- IPC: A61B17/00 ; A61B17/32 ; A61B18/00 ; A61B18/14 ; B23P11/02 ; B23P6/00 ; A61L2/20 ; A61B90/00 ; A61L101/02 ; A61L101/44

Abstract:
A medical apparatus remanufacturing method includes: disassembling a housing including a first housing and a second housing. The first housing can include a boss that is press-fitted to a boss hole of a press-fitted portion of a second housing to form an assembled state in which the first housing and the second housing are assembled to each other. The housing is disassembled by changing a temperature of at least one of the boss or the press-fitted portion to decrease a contact surface pressure between the boss and the boss hole, and removing the boss from the boss hole to release the assembled state.
Public/Granted literature
- US20210053165A1 MEDICAL APPARATUS REMANUFACTURING METHOD Public/Granted day:2021-02-25
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