Invention Grant
- Patent Title: Method and system for use in laser shock peening and laser bond inspection process
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Application No.: US16936260Application Date: 2020-07-22
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Publication No.: US11858065B2Publication Date: 2024-01-02
- Inventor: Tianyi Michael Yao , Timothy Thomas Gorman , Jeff L Dulaney
- Applicant: LSP Technologies, Inc.
- Applicant Address: US OH Dublin
- Assignee: LSP Technologies, Inc.
- Current Assignee: LSP Technologies, Inc.
- Current Assignee Address: US OH Dublin
- Main IPC: B23K26/06
- IPC: B23K26/06 ; B23K26/0622 ; B23K26/356 ; B23K26/70 ; B23K26/20 ; B23K26/064

Abstract:
A laser system includes an integrated fiber laser front-end, configured to generate and output a pre-amplified first pulsed laser beam having predefined beam characteristics corresponding to a user defined pulse shape and a user defined pulse width setting selection of a controller. The first pulsed laser beam is generated from a master oscillator which outputs a CW laser beam to a temporal pulse shaper, which modulates the CW laser beam to output the first pulsed laser beam in response to an electrical pulse from an arbitrary wave generator and a DC bias voltage from an automatic modulator bias control circuitry. The first pulsed laser beam is pre-amplified to an output pulsed laser beam for laser peening or laser bond inspection. A beam detector is used to monitor beam characteristics, and to generate an error signal to be sent back as a feedback signal to the controller for adjustments and corrections.
Public/Granted literature
- US20200346301A1 METHOD AND SYSTEM FOR USE IN LASER SHOCK PEENING AND LASER BOND INSPECTION PROCESS Public/Granted day:2020-11-05
Information query
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