Invention Grant
- Patent Title: Integrated circuit and method for manufacturing the same
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Application No.: US17332607Application Date: 2021-05-27
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Publication No.: US11751401B2Publication Date: 2023-09-05
- Inventor: Tzu-Yu Chen , Sheng-Hung Shih , Kuo-Chi Tu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/51
- IPC: H01L29/51 ; H01L29/66 ; H01L21/28 ; H01L29/78 ; H10B51/30 ; H10B51/40

Abstract:
A semiconductor device includes a semiconductor substrate, a memory gate, and a data storage element. The semiconductor substrate includes a memory well which has two source/drain regions and a channel region between the source/drain regions. The memory gate is disposed above the channel region. The data storage element includes a ferroelectric material, and is disposed around the memory gate to separate the memory gate from the channel region.
Public/Granted literature
- US20220384458A1 INTEGRATED CIRCUIT AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2022-12-01
Information query
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