Invention Grant
- Patent Title: Semiconductor device and fabrication method of the same
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Application No.: US17478147Application Date: 2021-09-17
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Publication No.: US11751381B2Publication Date: 2023-09-05
- Inventor: Seung Mi Lee
- Applicant: SK hynix Inc.
- Applicant Address: KR Gyeonggi-do
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T GROUP LLP
- Priority: KR 20210029507 2021.03.05
- Main IPC: H10B12/00
- IPC: H10B12/00

Abstract:
A semiconductor device includes: a bit line structure formed over a substrate; a storage node contact plug spaced apart from the bit line structure; and a nitride spacer positioned between the bit line structure and the storage node contact plug, wherein the nitride spacer has a higher silicon content in a portion adjacent to the storage node contact plug than in a portion adjacent to the bit line structure.
Public/Granted literature
- US20220285358A1 SEMICONDUCTOR DEVICE AND FABRICATION METHOD OF THE SAME Public/Granted day:2022-09-08
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