The present invention provides a component mounting machine -comprising a picking tool for picking electronic components from a source of electronic components and placing them onto a workpiece, a verification unit for measuring an electrical property of an electronic component picked and held by the picking tool. The verification unit comprises a board, a plurality of test electrodes arranged on a surface of said board and a system for measuring an output signal from the test electrodes upon contact between a picked electronic component and at least two of said test electrodes. Further, at least one test electrode arranged on a flexible portion of the board that is configured to flex upon engagement between a picked electronic component and said at least two test electrodes.