Invention Grant
- Patent Title: Cableless interconnect
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Application No.: US17488459Application Date: 2021-09-29
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Publication No.: US11751332B2Publication Date: 2023-09-05
- Inventor: Robert Drury , Sean Michael Robin
- Applicant: SOFTIRON LIMITED
- Applicant Address: GB Chilworth
- Assignee: SOFTIRON LIMITED
- Current Assignee: SOFTIRON LIMITED
- Current Assignee Address: GB London
- Agency: Slayden Grubert Beard PLLC
- Main IPC: H05K1/14
- IPC: H05K1/14

Abstract:
A baseboard includes a first connection configured to electrically interface with a motherboard, a second connection configured to electrically interface with a module, and a switch circuit configured to route data channels and power channels between the motherboard and the module. The first connection is configured to interface with more than one connection protocol or standard. The second connection is configured to interface with the more than one connection protocol or standard. The baseboard allows for cableless connections to allow unobstructed airflow over the components.
Public/Granted literature
- US20220104357A1 Cableless Interconnect Public/Granted day:2022-03-31
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