Invention Grant
- Patent Title: Substrate for medical device and medical device
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Application No.: US16928069Application Date: 2020-07-14
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Publication No.: US11751325B2Publication Date: 2023-09-05
- Inventor: Kiyotaka Kanno
- Applicant: Sony Olympus Medical Solutions Inc.
- Applicant Address: JP Tokyo
- Assignee: Sony Olympus Medical Solutions Inc.
- Current Assignee: Sony Olympus Medical Solutions Inc.
- Current Assignee Address: JP Tokyo
- Agency: XSENSUS LLP
- Priority: JP 14218673 2014.10.27
- Main IPC: H05K1/02
- IPC: H05K1/02 ; G02B23/24 ; A61B1/00 ; H05K1/18 ; A61B1/04 ; H04N23/00 ; A61N1/372 ; H01Q1/22 ; H01Q21/28

Abstract:
A substrate for a medical device, a portion of which is brought into contact with or inserted into a subject. The substrate includes a patient circuit conductively connected to the portion that is configured to be brought into contact with or inserted into the subject, and a ground-side circuit configured to perform at least one of transmission of a signal, reception of a signal, and supply of electric power on the patient circuit. The ground-side circuit is grounded by a protective ground to ensure safety of a manipulator of the medical device. The substrate also includes an insulating layer between the patient circuit and the ground-side circuit providing insulation between the patient circuit and the ground-side circuit, and an isolated circuit provided apart from the patient circuit and the ground-side circuit on the insulating layer and having a different reference potential from the patient circuit and the ground-side circuit.
Public/Granted literature
- US20200343621A1 SUBSTRATE FOR MEDICAL DEVICE AND MEDICAL DEVICE Public/Granted day:2020-10-29
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