Invention Grant
- Patent Title: DDR PHY floorplan
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Application No.: US17664567Application Date: 2022-05-23
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Publication No.: US11750196B1Publication Date: 2023-09-05
- Inventor: Praveen Kumar Kandukuri , Pavan Vithal Torvi
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM INCORPORATED
- Current Assignee: QUALCOMM INCORPORATED
- Current Assignee Address: US CA San Diego
- Agency: Procopio, Cory, Hargreaves & Savitch LLP
- Main IPC: H03K19/17736
- IPC: H03K19/17736 ; H03K19/1776

Abstract:
An IC includes a first set of core logic configured to convert data between a single stream and a double stream, and a first data I/O block on a first side of the first set of core logic. The first data I/O block interfaces with the first set of core logic and a DRAM. The IC further includes a second set of core logic configured to process CA information, and a first CA I/O subblock on a second side of the first set of core logic. The first CA I/O subblock interfaces with the second set of core logic and the DRAM. The IC further includes a first set of power switches adjacent at least one side of the first CA I/O subblock. The first set of power switches is coupled to the first set of core logic and the second set of core logic.
Information query
IPC分类: