Invention Grant
- Patent Title: Layered body, and saw device
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Application No.: US16754811Application Date: 2018-09-21
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Publication No.: US11750171B2Publication Date: 2023-09-05
- Inventor: Keiichirou Geshi , Masato Hasegawa , Shigeru Nakayama
- Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Osaka
- Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee Address: JP Osaka
- Agency: Faegre Drinker Biddle & Reath LLP
- Priority: JP 17198778 2017.10.12
- International Application: PCT/JP2018/034960 2018.09.21
- International Announcement: WO2019/073781A 2019.04.18
- Date entered country: 2020-04-09
- Main IPC: H03H9/02
- IPC: H03H9/02 ; H03H3/08 ; H03H9/25 ; H10N30/06 ; H10N30/072 ; H10N30/086
Abstract:
A ceramic substrate is formed of polycrystalline ceramic and has a supporting main surface. At the supporting main surface of the ceramic substrate, the mean of grain sizes of the polycrystalline ceramic is 0.5 μm or more and less than 15 μm and the standard deviation of the grain sizes is less than 1.5 times the mean.
Public/Granted literature
- US20210104999A1 LAYERED BODY, AND SAW DEVICE Public/Granted day:2021-04-08
Information query
