Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
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Application No.: US17968778Application Date: 2022-10-18
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Publication No.: US11749743B2Publication Date: 2023-09-05
- Inventor: Fu-Jung Chuang , Tsuo-Wen Lu , Chia-Ming Kuo , Po-Jen Chuang , Chi-Mao Hsu
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: TW 8119452 2019.06.05
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/02 ; H01L29/78 ; H01L21/311

Abstract:
A semiconductor device includes a gate structure on a substrate, a first spacer on sidewalls of gate structure, a second spacer on sidewalls of the first spacer, a polymer block adjacent to the first spacer and on a corner between the gate structure and the substrate, an interfacial layer under the polymer block, and a source/drain region adjacent to two sides of the first spacer. Preferably, the polymer block is surrounded by the first spacer, the interfacial layer, and the second spacer.
Public/Granted literature
- US20230041596A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2023-02-09
Information query
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