Invention Grant
- Patent Title: Method for forming semiconductor structure
-
Application No.: US17489813Application Date: 2021-09-30
-
Publication No.: US11749741B2Publication Date: 2023-09-05
- Inventor: Zhe Wang , Lu Zou
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: CN 2111048449.1 2021.09.08
- Main IPC: H01L21/324
- IPC: H01L21/324 ; H01L29/66 ; H01L29/78 ; H01L21/02

Abstract:
The invention provides a method for forming a semiconductor structure. The method includes providing a substrate, forming a gate structure on the substrate, respectively forming an epitaxial layer on both sides of the gate structure, and performing a pre-amorphization doping step on the substrate. After the pre-amorphization doping step, a defect is generated in the epitaxial layer, an outer spacer is formed beside the gate structure, and a chemical cleaning step is performed to remove a part of the epitaxial layer, and the defect in the epitaxial layer is removed.
Public/Granted literature
- US20230070135A1 Method for forming semiconductor structure Public/Granted day:2023-03-09
Information query
IPC分类: